Dual-substrate heatsink
The dual-substrate heatsink offers a larger heat transfer area, allowing for over twice the heat transfer area compared to aluminum extrusion of the same volume. This technology is currently highly mature and has been widely applied abroad, including in the demanding heat dissipation requirements of military equipment. The adhesive heatsinks developed by Pipecool Technology achieve both exquisite appearance and thermal resistance comparable to aluminum extrusion. Additionally, heat pipes are embedded within the substrate to ensure more uniform temperature distribution.
1. Keep your devices cool and running smoothly with our dual-sided heat sink. Its innovative design ensures efficient heat dissipation from both sides, maximizing performance and prolonging the lifespan of your electronics.
2. Experience enhanced thermal management like never before. Our dual-sided heat sink features a specially engineered dual-layer structure that provides optimal heat transfer, preventing overheating and ensuring stable operation even during intense usage.
3. Upgrade your gaming or work setup with our dual-sided heat sink. Its sleek and modern design not only enhances the aesthetics of your devices but also ensures efficient cooling, allowing you to push your electronics to the limit without worrying about overheating.
Uses: Heat dissipation of military equipment with harsh conditions;
4. Size range: 1000 mm in length * 1000 mm in width * 100mm in height, and the minimum spacing between teeth is 2.5mm；;
5. Description of molding principle: The base plate is slotted, and then the blades with corresponding specifications are inserted. One side is riveted firmly, and the other side is bonded with epoxy resin. The molding principle is as follows:
